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Mobile World Congress 2026: Beyond-G Global Innovation Center Showcases AI-Native Wireless Innovations

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At Mobile World Congress 2026 (MWC 2026), held March 2–5 in Barcelona, the Beyond-G Global Innovation Center, under the leadership of Sunwoo Kim, presented its latest AI-native wireless technologies to the global mobile communications community. During the event, Beyond-G showcased two AI-native wireless network innovations powered by Digital Twin technology at the booths of VIAVI Solutions and the AI-RAN Alliance.


AI Beam Tracking with Digital Twin showcased how AI-driven beam management combined with Digital Twin environments can enhance mobility robustness and network performance. The demonstration was presented alongside leading global innovators shaping the future of AI-native radio access networks.


AI Beam Tracking with Digital Twin


AI-Powered Tilt Optimization with Digital Twin highlighted the results of a successful research collaboration between Beyond-G and VIAVI Solutions. The demonstration illustrated how AI-enabled Digital Twins can optimize antenna configurations to improve network efficiency and coverage.


AI-Powered Tilt Optimization with Digital Twin


Through these demonstrations, Beyond-G showed how AI-native network intelligence combined with Digital Twin technology can enable adaptive, data-driven optimization of wireless networks—an essential capability for the evolution toward 6G systems. In addition, Beyond-G signed a Memorandum of Understanding (MOU) with Keysight Technologies during the event, establishing a foundation for expanded collaboration in next-generation wireless research, testing, and innovation.


Participation in Mobile World Congress 2026 provided a valuable platform for the Beyond-G Global Innovation Center to demonstrate its cutting-edge research, engage with global industry leaders, and strengthen strategic partnerships, further advancing its mission to drive innovation in AI-native wireless communications.


▲ WSL members at the AI-RAN Alliance booth (Barcelona, Spain)


 WSL members at the VIAVI Solutions booth (Barcelona, Spain)



 
 
 

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김선우 교수

한양대학교 융합전자공학부

서울특별시 성동구 왕십리로 한양대학교, 04763

교수연구실: IT/BT관 817호 T) +82-2-2220-4823

학생연구실: 퓨전테크센터 516호/1103호

​행정실: 퓨전테크센터 1103호 T) +82-2-2220-4822

Professor Sunwoo Kim

Dept. of Electronic Engineering, Hanyang University

222 Wangsimri-ro Seongdong-gu Seoul Korea, 04763

T) +82-2-2220-4822

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